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Assembly of many electronic components involves multiple washing processes to remove residue, oil, acids and other lubricants and contaminants before during and following various process steps. This generates large volumes of wastewater containing alkaline, acid solutions, heavy metal wastewaters, paint, plating residue wastewater, and other metal fabrication wastewaters.
Polishing, grinding and dicing operations in semiconductor manufacturing produce wastewater high in suspended solids, including silica, aluminum and cerium oxide. There are also varying amounts of dissolved materials presen in the wastewatert, such as oxidizing agents, inorganic ions, and organic compounds, as well as copper, complexing agents, and corrosion inhibitors.